8. Packaging and Testing.zip
Cutting the wafer into individual chips, mounting them into packages, and performing final testing.
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Additional Information
| Field | Value |
|---|---|
| Data last updated | 2025 जुलाई 29 |
| Metadata last updated | 2025 जुलाई 29 |
| Created | 2025 जुलाई 8 |
| Format | ZIP |
| License | No License Provided |
| Datastore active | False |
| Has views | False |
| Id | 8f70aae1-8fb6-4fcb-b920-5186952b8b8e |
| Mimetype | application/zip |
| Package id | 2c245f98-7096-4025-b59e-580fa01539a5 |
| Position | 7 |
| Size | 568.8 किलोबाइट |
| State | active |
| Url type | upload |